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Green
TB0640H - TB3500H
100A BIDIRECTIONAL SURFACE MOUNT THYRISTOR SURGE PROTECTIVE DEVICE
Features
* * * * * * * * * * 100A Peak Pulse Current @ 10/1000s 400A Peak Pulse Current @ 8/20s 58 - 320V Stand-Off Voltages Oxide-Glass Passivated Junction Bidirectional Protection In a Single Device High Off-State Impedance and Low On-State Voltage Helps Equipment Meet GR-1089-CORE, IEC 61000-4-5, FCC Part 68, ITU-T K.20/K.21, and UL497B UL Listed Under Recognized Component Index, File Number 156346 Lead Free Finish/RoHS Compliant (Note 1) Green Molding Compound (No Halogen and Antimony) (Note 2)
Mechanical Data
* * * * * * * * Case: SMB Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: None; Bidirectional Devices Have No Polarity Indicator Marking Information: See Pages 2 & 4 Ordering Information: See Page 4 Weight: 0.093 grams (approximate)
Top View
Bottom View
Maximum Ratings
@TA = 25C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Non-Repetitive Peak Impulse Current Non-Repetitive Peak On-State Current Typical Positive Temperature Coefficient for Breakdown Voltage @10/1000us @8.3ms (one-half cycle) Symbol Ipp ITSM VBR/TJ Value 100 50 0.1 Unit A A %/C
Thermal Characteristics
Characteristic Thermal Resistance, Junction to Lead Thermal Resistance, Junction to Ambient Junction Temperature Range Storage Temperature Range Symbol RJL RJA TJ TSTG Value 20 100 -40 to +150 -55 to +150 Unit C/W C/W C C
Maximum Rated Surge Waveform
IPP, PEAK PULSE CURRENT (%)
Peak Value (Ipp) tr = rise time to peak value tp = decay time to half value
Waveform 2/10 us 8/20 us 10/160 us 10/700 us 10/560 us 10/1000 us
Standard GR-1089-CORE IEC 61000-4-5 FCC Part 68 ITU-T, K.20/K.21 FCC Part 68 GR-1089-CORE
Ipp (A) 500 400 250 200 160 100
Half Value
tr
tp
TB0640H - TB3500H
Document number: DS30360 Rev. 9 - 2
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TB0640H - TB3500H Electrical Characteristics
Maximum Rated Repetitive Off-State Voltage VDRM (V) TB0640H TB0720H TB0900H TB1100H TB1300H TB1500H TB1800H TB2300H TB2600H TB3100H TB3500H 58 65 75 90 120 140 160 190 220 275 320 @TA = 25C unless otherwise specified Maximum Breakover Voltage VBO (V) 77 88 98 130 160 180 220 265 300 350 400 Maximum On-State Voltage @ IT = 1A VT (V) 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 Breakover Current IBO Min (mA) 50 50 50 50 50 50 50 50 50 50 50 Max (mA) 800 800 800 800 800 800 800 800 800 800 800 Typical Off-State Capacitance CO (pF) 200 200 200 120 120 120 120 80 80 80 80 T064H T072H T090H T110H T130H T150H T180H T230H T260H T310H T350H
Part Number
Maximum Off-State Leakage Current @ VDRM IDRM (uA) 5 5 5 5 5 5 5 5 5 5 5
Holding Current IH Min (mA) 150 150 150 150 150 150 150 150 150 150 150 Max (mA) 800 800 800 800 800 800 800 800 800 800 800
Marking Code
Symbol VDRM IDRM VBR IBR VBO IBO IH VT IPP CO
Notes:
Parameter Stand-off Voltage Leakage current at stand-off voltage Breakdown voltage Breakdown current Breakover voltage Breakover current Holding current On state voltage Peak pulse current Off-state capacitance Note 4 Note 3
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/quality/lead_free.html. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. IH > (VL/RL) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge recovery time does not exceed 30ms. 4. Off-state capacitance measured at f = 1.0MHz, 1.0VRMS signal, VR = 2VDC bias.
I IPP
IBO IH IBR IDRM VT VDRM VBR VBO
V
TB0640H - TB3500H
Document number: DS30360 Rev. 9 - 2
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(c) Diodes Incorporated
TB0640H - TB3500H
100
1.2 NORMALIZED BREAKDOWN VOLTAGE
I(DRM), OFF-STATE CURRENT (uA)
1.15
10
1.1
1
1.05
0.1
VDRM = 50V
1
0.01
0.95
0.001 -25
0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) Fig. 1 Off-State Current vs. Junction Temperature
0.9 -50
-25 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (C) Fig. 2 Relative Variation of Breakdown Voltage vs. Junction Temperature
1.1 NORMALIZED BREAKDOWN VOLTAGE
100
1.05
IT, ON-STATE CURRENT (A)
10
1
0.95 25 50 75 100 125 150 175 0 -50 -25 TJ, JUNCTION TEMPERATURE (C) Fig. 3 Relative Variation of Breakover Voltage vs. Junction Temperature
1.4 1.3 NORMALIZED HOLDING CURRENT 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 -50
NORMALIZED CAPACITANCE
1
1
5 2 2.5 3 3.5 4.5 4 VT, ON-STATE VOLTAGE (V) Fig. 4 On-State Current vs. On-State Voltage 1.5
1
0.1
-25 25 50 75 100 125 0 TJ, JUNCTION TEMPERATURE (C) Fig. 5 Relative Variation of Holding Current vs. Junction Temperature
1
10 100 VR, REVERSE VOLTAGE (V) Fig. 6 Relative Variation of Junction Capacitance vs. Reverse Voltage Bias
TB0640H - TB3500H
Document number: DS30360 Rev. 9 - 2
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September 2010
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TB0640H - TB3500H Ordering Information (Note 5)
Part Number TB0640H-13-F TB0720H-13-F TB0900H-13-F TB1100H-13-F TB1300H-13-F TB1500H-13-F TB1800H-13-F TB2300H-13-F TB2600H-13-F TB3100H-13-F TB3500H-13-F
Notes:
Case SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB SMB
Packaging 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
YWW xxxxx
xxxxx = Product type marking code (See table on page 2) = Manufacturers' code marking YWW = Date code marking Y = Last digit of year (ex: 6 for 2006) WW = Week code (01 to 53)
Package Outline Dimensions
B
A
C
D J
SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm
H E
G
Suggested Pad Layout
C
X
Dimensions Value (in mm) Z 6.8 G 1.8 X 2.3 Y 2.5 C 4.3
Y G Z
TB0640H - TB3500H
Document number: DS30360 Rev. 9 - 2
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September 2010
(c) Diodes Incorporated
TB0640H - TB3500H
IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2010, Diodes Incorporated www.diodes.com
TB0640H - TB3500H
Document number: DS30360 Rev. 9 - 2
5 of 5 www.diodes.com
September 2010
(c) Diodes Incorporated

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